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Packaging Hot Melt

Packaging Hot Melt Adhesives
Packaging Hot Melt

Innovative performance hot melts from Evans Adhesive are perfect for a broad range of industries including packaging and paper converting.

Packaging hot melt adhesives, whether synthetic or natural-based, are solid at room temperature and are liquid at a raised temperature of application.

Depending on the product and use, the application temperature may be between 225 and 425°F.
Many hot melts are designed for speed of set, requiring as little as one-half second compression in order to form an initial bond.

Like our water-based adhesives, Evans offers a wide variety of hot melt products designed to fit special needs.

EVA

EVA (Ethylene Vinyl Acetate)

Hot melts based on Ethylene Vinyl Acetate are designed for a variety of coated and uncoated paper product applications. EVA hot melts set quickly at between 1-10 seconds, are water proof and can offer some heat and cold resistance. Many of our packaging hot melts are based on EVA and are …

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Polyethylene

Polyethylene

Polyethylene hot melts are ideal for case, carton and tray sealing applications. Polyethylenes provide better thermal stability, are low odor and light colored.

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Metallocene

Metallocene

Metallocene hot melts are ideal for case, carton and tray sealing applications. Metallocenes provide better thermal stability, are low odor and light colored.

Evans’ latest and most in-demand metallocene product is the new ReliaSeal 7359, a char-free packaging hot melt adhesive designed to eliminate costly downtime and repair expense that can occur from carbon …

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APAO

APAO

Amorphous Poly Alpha Olafins or APAOs are used where open time and tack are needed. APAOs are non-crystalline and are soft, tacky, and flexible, making them a good choice for many product assembly applications.

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Polyamides

Polyamides

Polyamide hot melts are used where special needs arise, such as in high temperature applications or high strength needs. Polyamides provide resistance to oils and solvents, making them an excellent choice for difficult to bond, low energy substrates.

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